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Anyway, what most people see and call a "chip" is actually the packaging. The actual semiconductor die is embedded in the packaging and is not visible.
I figured on this nerd thread we had a fairly conversant group, but ok.
Chips may show 'diffused' in different locations because for some companies the "chips" aren't a single monolithic die. There may be multiple die that perform different functions integrated into the package. There may be things called "chiplets" that perform certain tasks like AI hardware acceleration or integrated GPUs (graphics engines) and it makes sense that these are fabbed in different foundries in different countries. The CPU may require the performance obtained from a cutting edge 3 nm technology and it would be fabbed at TSMC (Taiwan). The GPU and chiplets may not need that high degree of expensive technology and would be fabbed elsewhere like in the US. The 'diffused' description has to reflect the sourcing of those different die.
And when Trump suggested we should build chips here instead of relying on the "global economy", the Left accused him of racism and isolationism.
Funny how that works huh?!
Thanks for noting that. A person I might know working at a company of some sort that you may have heard of that was in grave financial shape was involved in a technology transfer to China back in 2015. Critical IP. Cutting edge stuff, not licensed just simply transferred for cash and royalties on the back end from sales in China. Said company had to consult with DOD and CIA on the transfer which was then approved by the Obama administration. The week that Trump took office that IP transfer was halted. Not good for said company's bottom line but good for America.
A chip fab isn't a chip fab isn't a chip fab. We have a few gigantic fabs here in the US but they don't necessarily have the "right" fabs that TSMC has. So hopefully we are investing in the right fab technology to give the chips that we actually need.
A chip fab isn't a chip fab isn't a chip fab. We have a few gigantic fabs here in the US but they don't necessarily have the "right" fabs that TSMC has. So hopefully we are investing in the right fab technology to give the chips that we actually need.
TSMC was already building a 3nm (I think) fab in Arizona which is great. Not sure whether or not the chips act gave them anything but that fab can't come online too soon. I know Intel who still owns its own fabs got some gravy out of the deal.
We started outsourcing that because of the EPA...environmental hazards.
Don't you remember that ?
We do a lot of things for reasons like that.
But environmental hazards are a global thing right?
I know....NIMBY......
Well, look where that got us.
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I figured on this nerd thread we had a fairly conversant group, but ok.
