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My naked e8400, I removed the IHS (cap that protects the actual cpu core) under my wet sanded cooler It was a nerve racking project and yielded no results (aiming for cooler temps and higher overclock), but it was a fun experience, once. After endless computer builds, I've become a big fan of Corsair PSU, highly recommended.
My naked e8400, I removed the IHS (cap that protects the actual cpu core) under my wet sanded cooler It was a nerve racking project and yielded no results (aiming for cooler temps and higher overclock), but it was a fun experience, once. After endless computer builds, I've become a big fan of Corsair PSU, highly recommended.
Wow, with such a huge cooler bottom plate you might have a problem aligning it evenly on the chip, which would force the heat dissipation paste or whatever it is called towards one edge of the chip
I won't do anything like that, but I will remove the preapplied patch and use a good paste instead...
Wow, with such a huge cooler bottom plate you might have a problem aligning it evenly on the chip, which would force the heat dissipation paste or whatever it is called towards one edge of the chip
I won't do anything like that, but I will remove the preapplied patch and use a good paste instead...
Yeah, if you read the entire tread I linked documenting the project, pressure to push the CPU into socket ended up being one of the hurdles; And never fully solved it because I continue to have a 8 deg difference or so between cores.
When it comes to thermal paste, less is more; Meaning you don't really want enough on there to create a layer and squish over the edge, you essentially put it in there to fill the micro gaps between the CPU and heatsink (basically topical imperfections), not to put a layer of goop between them. Usually not more then a grain of rice (size) of the initial dab for a socket 775 chip. Filling those gaps is one reason why wet sanding the heatsink and CPU can result in huge temp drops. Best I've seen is a 15 deg drop @ full load vs non lapped, it definitely makes a difference.
Yeah remove the stock paste, clean with 95% + Isoproplyn (no idea on spelling off hand) Alcohol and re-apply using something like Artic Silver 5.
Yeah, if you read the entire tread I linked documenting the project, pressure to push the CPU into socket ended up being one of the hurdles; And never fully solved it because I continue to have a 8 deg difference or so between cores.
When it comes to thermal paste, less is more; Meaning you don't really want enough on there to create a layer and squish over the edge, you essentially put it in there to fill the micro gaps between the CPU and heatsink (basically topical imperfections), not to put a layer of goop between them. Usually not more then a grain of rice (size) of the initial dab for a socket 775 chip. Filling those gaps is one reason why wet sanding the heatsink and CPU can result in huge temp drops. Best I've seen is a 15 deg drop @ full load vs non lapped, it definitely makes a difference.
Yeah remove the stock paste, clean with 95% + Isoproplyn (no idea on spelling off hand) Alcohol and re-apply using something like Artic Silver 5.
Oh, so I definitely did it the wrong way with my first computer many years ago. I remember covering the whole chip with the paste, looked like icing on a cake
So I have to put just very little in the middle and it will spread in all directions, so that there are no air bubbles...
Does the paste also function as insulation between the two different metals? I read somewhere that there might be electrical potentials where two different metals meet. That is why gold-plated plugs might even be worse than normal steel ones because the female counterpart is usually not gold-plated.
On your copper plate one can see the topical imperfections with the naked eye.
Oh, so I definitely did it the wrong way with my first computer many years ago. I remember covering the whole chip with the paste, looked like icing on a cake
So I have to put just very little in the middle and it will spread in all directions, so that there are no air bubbles...
Does the paste also function as insulation between the two different metals? I read somewhere that there might be electrical potentials where two different metals meet. That is why gold-plated plugs might even be worse than normal steel ones because the female counterpart is usually not gold-plated.
On your copper plate one can see the topical imperfections with the naked eye.
Dunno about the 2 different metals comment. The paste however is there for nothing else other then thermal transfer to the heat sink. Another reason to lap the bottom of a heat sink is they sometimes won't be 100% flat on the bottom, same with the IHS on the CPU. I've had some CPU's that pretty much required sanding the chip because the IHS (the silver color metal cap on cpu) had a dip in the middle, or raised edges, either way it needed to be sanded if I wanted to overclock. Even stock it ran hot until I sanded it.
I like copper heatsinks, they tend to dissipate heat better in my experiences.
I have read a bit about temperatures, which after all are the reason for any cooling efforts. It said on one site that many motherboards by default apply too high a voltage to the processor, which results in temperatures that are up to 10K higher than they need to be, not to mention unnecessary noise resulting from higher fan speeds, especially with the boxed coolers.
I have read a bit about temperatures, which after all are the reason for any cooling efforts. It said on one site that many motherboards by default apply too high a voltage to the processor, which results in temperatures that are up to 10K higher than they need to be, not to mention unnecessary noise resulting from higher fan speeds, especially with the boxed coolers.
I'm yet to run into one mobo that overvolts 'stock' since things moved past P III's lol. Err not to mention temps up 10k? WTF is 10k, temps are measure in Celsius typically. Sounds like a tool making **** up on an overclocking forum.
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